Congress has passed a bill that will invest more than $200 billion over the next five years to help the U.S. regain a leading position in semiconductor chip manufacturing.With bipartisan support, the ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has jointly developed a new standard package for power modules with integrated 3-level circuits, designed for industrial drive ...
Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...
TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...
Kaynes SemiCon, a fully owned subsidiary of Kaynes Technology India, has emphasized the value of legacy semiconductor packages in driving the country's manufacturing goals. In a recent interview with ...
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