E+E Elektronik will showcase sensor solutions that help operators and system integrators optimize processes in measurable ...

According to a report from Korea JoongAng Daily, the Taylor, Texas, fab has been delayed with pilot production now slated to be completed by the end of 2026. Pilot production is considered a major ...

Applied Materials Inc. and Micron Technology are collaborating to develop next-generation DRAM, high-bandwidth memory (HBM) and NAND memory that increase energy efficiency performance in AI systems.

According to a report from Reuters, Japan has set a goal of $253.6 billion in annual sales by 2040, up from roughly $50.3 billion in 2025. This is an extension of the original target of $94.4 billion ...

APEC has quickly become one of the pre-eminent events on the electronics industry calendar. The booming power electronics market offers significant opportunity, and the conference draws a large ...

Broadcom Inc.’s 3 nm 400 G/lane optical PAM-4 digital signal processor (DSP) is now available, designed for next generation ...

Everspin Technologies Inc. is seeking to challenge traditional NOR flash memory with the introduction of unified magnetoresistive random access memory (MRAM) technology for embedded systems. Called ...

Starlink, in a partnership with Deutsche Telekom, will bring mobile communications to areas where network expansion is ...

The collaboration addresses one of the most significant challenges in large-scale electrification: reducing energy losses and ...

Shimadzu Scientific Instruments has introduced an on-line total organic carbon (TOC) analyzer designed to meet ultrapure ...

Arduino launched its latest platform at Embedded World 2026 called Ventuno Q, powered by Qualcomm Dragonwing IQ-8 series. Arduino, which was acquired by Qualcomm in October of 2025, said the single ...

GOWIN Semiconductor has launched its next-generation Arora GW1AN and GW3A field-programmable gate array (FPGA) families, ...