Vertical Semiconductor's CEO discusses scaling FinFET vertical GaN on engineered substrates for AI data center power ...

The new IC consumes less than 0.75mW at 230VAC and supports AC-DC designs with X-capacitance from 100nF to 6μF.

The new rectifiers improve thermal performance and surge capability while supporting automated optical inspection in compact PCB designs.

The system combines 12 A/µs current dynamics, 95% energy recovery and scalable power to 1,920 kW for advanced power-system ...

The TPF12500 combines wide-range 3-phase input, 97.5% efficiency and parallel operation for high-power industrial and data-center systems. TDK Corporation introduced the TDK-Lambda TPF12500-385 series ...

Power electronics enables the hydrogen economy, converting AC to high-current DC for electrolyzers and reverse for fuel cells ...

The sensor combines 2µs output refresh, speeds above 50,000 rpm and three-axis magnetic sensing in a compact DFN-6 package.

TI's TMCS2100-Q1 uses multiaxial sensing to reject crosstalk in coreless Hall-effect current sensors for traction inverters.

The new SY757xx family combines voltage translation, low additive jitter and compact packaging for high-speed FPGA and SoC ...

The new series offers up to 83,000 µF, 300 V ratings and 10,000-hour endurance for demanding compact power applications.

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Navitas’ Claros Acquisition, ...